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FR-ADP02
0.2
White Powder
23.5
1-3
350
FCCL, FFC, CCL
| Quantity: | |
|---|---|
Description
FR-ADP02 is a white powder, small-size particle, phosphorus-containing organic aluminum flame retardant. It is mainly used in ultra-thin adhesives, flexible epoxy layered printed circuit boards, and TPE (TPEE, TPU, and PEBA).
Advantages
High hydrophobicity.
Good thermal stability.
No migration.
Typical Properties
| Physical Properties | Unit | Target Value |
| Phosphorus Content | % (w/w) | 23.5 |
| Density | g/cm3 | 1.35 |
| Bulk Density | g/cm3 | 250 |
| Water/Moisture | % (w/w) | 0.2 |
| Decomposition Temperature (at 2% weight loss) | ℃ | 350 |
| Average Particle Size (D50) | μm | 2 |
Usage
Ø High-end product applications:
Due to its specially designed particle size distribution, FR-ADP02 is particularly suitable for high-end applications such as ultra-thin flexible copper clad laminates (FCCL), FFC insulation films, FFC stiffeners, and epoxy resin-based copper clad laminates (CCL), that require halogen-free flame retardancy and have high requirements for electrical performance and thermal stability.
Ø In combination with nitrogen-containing flame retardants:
There is a good flame retardant synergistic effect.
Packaging & Storage
Packaged in a paper-plastic composite bag and lined with a plastic bag. 12.5 kg per package.
The product must be sealed, kept dry, dust-free, and cool.
Description
FR-ADP02 is a white powder, small-size particle, phosphorus-containing organic aluminum flame retardant. It is mainly used in ultra-thin adhesives, flexible epoxy layered printed circuit boards, and TPE (TPEE, TPU, and PEBA).
Advantages
High hydrophobicity.
Good thermal stability.
No migration.
Typical Properties
| Physical Properties | Unit | Target Value |
| Phosphorus Content | % (w/w) | 23.5 |
| Density | g/cm3 | 1.35 |
| Bulk Density | g/cm3 | 250 |
| Water/Moisture | % (w/w) | 0.2 |
| Decomposition Temperature (at 2% weight loss) | ℃ | 350 |
| Average Particle Size (D50) | μm | 2 |
Usage
Ø High-end product applications:
Due to its specially designed particle size distribution, FR-ADP02 is particularly suitable for high-end applications such as ultra-thin flexible copper clad laminates (FCCL), FFC insulation films, FFC stiffeners, and epoxy resin-based copper clad laminates (CCL), that require halogen-free flame retardancy and have high requirements for electrical performance and thermal stability.
Ø In combination with nitrogen-containing flame retardants:
There is a good flame retardant synergistic effect.
Packaging & Storage
Packaged in a paper-plastic composite bag and lined with a plastic bag. 12.5 kg per package.
The product must be sealed, kept dry, dust-free, and cool.
