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FR-ADP02
225789-38-8
23-24
1-3
350
FCCL, FFC, CCL，flame retardant tape
| Quantity: | |
|---|---|
Description
FR-ADP02 is a white, phosphorus-containing organic aluminum flame retardant in the form of a small-sized particle powder. It is primarily used in ultra-thin adhesives, flexible epoxy layered printed circuit boards, and TPE (including TPEE, TPU, and PEBA).
FR-ADP02 has several advantages as a flame retardant. It is highly hydrophobic, meaning it repels water, and it has good thermal stability, making it suitable for use in high-heat environments. Additionally, FR-ADP02 does not migrate, ensuring that it remains in place and continues to provide protection against fire.
Typical Properties
| Physical Properties | Unit | Target Value |
| Phosphorus Content | % (w/w) | 23.5 |
| Density | g/cm3 | 1.35 |
| Bulk Density | g/cm3 | 250 |
| Water/Moisture | % (w/w) | 0.2 |
| Decomposition Temperature (at 2% weight loss) | ℃ | 350 |
| Average Particle Size (D50) | μm | 2 |
Usage
Ø High-end product applications:
FR-ADP02 is particularly well-suited for high-end applications that require halogen-free flame retardancy and have high requirements for electrical performance and thermal stability. This is due to its specially designed particle size distribution. Some examples of such applications include ultra-thin flexible copper clad laminates (FCCL), FFC insulation films, FFC stiffeners, and epoxy resin-based copper clad laminates (CCL).
Ø In combination with nitrogen-containing flame retardants:
There is a strong synergistic effect in terms of flame retardancy.
Packaging & Storage
Packaged in a paper-plastic composite bag and lined with a plastic bag. 12.5 kg per package.
The product must be sealed, kept dry, dust-free, and cool.
Description
FR-ADP02 is a white, phosphorus-containing organic aluminum flame retardant in the form of a small-sized particle powder. It is primarily used in ultra-thin adhesives, flexible epoxy layered printed circuit boards, and TPE (including TPEE, TPU, and PEBA).
FR-ADP02 has several advantages as a flame retardant. It is highly hydrophobic, meaning it repels water, and it has good thermal stability, making it suitable for use in high-heat environments. Additionally, FR-ADP02 does not migrate, ensuring that it remains in place and continues to provide protection against fire.
Typical Properties
| Physical Properties | Unit | Target Value |
| Phosphorus Content | % (w/w) | 23.5 |
| Density | g/cm3 | 1.35 |
| Bulk Density | g/cm3 | 250 |
| Water/Moisture | % (w/w) | 0.2 |
| Decomposition Temperature (at 2% weight loss) | ℃ | 350 |
| Average Particle Size (D50) | μm | 2 |
Usage
Ø High-end product applications:
FR-ADP02 is particularly well-suited for high-end applications that require halogen-free flame retardancy and have high requirements for electrical performance and thermal stability. This is due to its specially designed particle size distribution. Some examples of such applications include ultra-thin flexible copper clad laminates (FCCL), FFC insulation films, FFC stiffeners, and epoxy resin-based copper clad laminates (CCL).
Ø In combination with nitrogen-containing flame retardants:
There is a strong synergistic effect in terms of flame retardancy.
Packaging & Storage
Packaged in a paper-plastic composite bag and lined with a plastic bag. 12.5 kg per package.
The product must be sealed, kept dry, dust-free, and cool.
